홈으로sitemapintranet
홈으로
   

> LTE  > SoC

       
chip
ip
platform
 
   
   
- M2M SoC


• Specification : 3GPP LTE Release 9 (FDD and TDD)
• UE Category 1 (DL 10 Mbps / UL 5 Mbps)
• UE L1/L2/L3 SW porting, HARQ processing
• ADC/DAC embedded on chip / MCP with memory
• Estimated gate count : 5.5M including HARQ memory
• Die size : 4.5mm x 4.5mm
• SMIC 55 nm fab-in scheduled on July 2014
   
M2M Module Development


• 800MHz RF Transceiver included in module
• 1.4 ~ 20 MHz bandwidth / Output power : 23dBm
• 1-Tx / 2-Rx antenna
• USB, Sensor node, USIM supported

   
Stand alone IP access support


• Support of standing-alone TCP/IP access based on LwIP.
• Can access various M2M Sensor nodes.